News & Media

Plexus teams with Indiana Integrated Circuits to develop Quilt Packaging production assembly process

NASDAQ GlobeNewswire, Sep. 2016:  Plexus to provide microelectronic design, assembly & test for IIC’s proprietary “Quilt Packaging” microchip integration technology.


Making connections

Milwaukee Journal-Sentinal, Sep. 2016


1st Source Commercialization Award goes to Electrical Engineering’s Gary Bernstein

Notre Dame, Apr. 2016: Gary H. Bernstein has been named recipient of the 1st Source Bank Commercialization Award celebrating his “quilt packaging” microchip packing technology. More.


Indiana Integrated Circuits closes fundraising round

South Bend Tribune, Mar. 2016: Indiana Integrated Circuits, a technology firm based at Innovation Park at Notre Dame, announced this week that it has closed a round of investment with a group of national private and institutional investors. More.


Quilt Packaging: A New Twist on 2D – or 3D

EE Journal, Mar. 2015: Indiana Integrated Circuits (IIC) believes they have a viable alternative to vertical packaging: it’s a better way to stay horizontal by literally soldering the component dice together into what can function, mechanically, as a single heterogeneous die. They call it “quilt packaging.” More.


Notre Dame Spin-out Company Wins Big at International Conference on Microelectronics

Notre Dame, Dec. 2014: Indiana Integrated Circuits, LLC (IIC), an Innovation Park-based company that was co-founded by Notre Dame faculty and researchers, has recently been awarded the highly coveted, $150,000 Elevator Pitch Prize from the MEMS (Microelectromechanical Systems) Industry Group. The prize is directed toward fabrication and prototyping services to be provided by MEMs foundry Rogue Valley Microdevices of Medford, Oregon. More

EE Times: Moore's Law Competitor Wins $150K Elevator Pitch Prize


Notre Dame Professor Named 2014 Indiana Master of Innovation

Gary Bernstein Victor Smith IEDC
Victor Smith (Indiana Secretary of Commerce) and Gary Bernstein

Notre Dame, Nov. 2014: Gary Bernstein, Frank Freimann Professor of Electrical Engineering and Associate Director of Notre Dame’s Center for Nanoscience and Technology (NDnano), was awarded the inaugural Indiana Master of Innovation Award from the Indiana Economic Development Corporation and Forbes, Inc. for his work on the development of Quilt Packaging (QP) technology. More | Video


Indiana Integrated Circuits’ technology drawing interest

South Bend Tribune, Nov. 2014: A company based at Innovation Park at Notre Dame has developed a process that could make waves in the electronics industry. More


Notre Dame researchers awarded millions to develop radically new computers

Notre Dame, Oct. 2011: Reflecting its worldwide leadership in the search for new computing technologies, the University of Notre Dame has received two of 12 prestigious grants for cutting-edge nanoelectronics research that were awarded recently by the Semiconductor Research Corporation’s Nanoelectronics Research Initiative (SRC-NRI) and the National Science Foundation. More


MIND receives contract extension

Notre Dame, Apr. 2011: The Midwest Institute for Nanoelectronics Discovery (MIND) has received a contract extension for another two years. Led by the University of Notre Dame, MIND is a research consortium designed to discover and develop the next nanoscale logic device. More


Bernstein named to UConn Academy of Distinguished Engineers

U Conn medallion

University of Connecticut, Mar. 2011: The UConn School of Engineering celebrated the accomplishments of 11 alumni and friends during a gala awards banquet. | More


DARPA grant to fund research into magnetic logic

Notre Dame, Nov. 2010: Magnets are already being used in memory and data storage, but the Notre Dame team’s research demonstrates that nanomagnets can be used for logic functions. More


Midwest nanoelectronics research center to fund silicon alternatives work at universities

Notre Dame, Mar. 2008: Research at the center is set to begin later this year by a team of university professors, students, and researchers, as well as engineers and other professionals from sponsor companies and organizations. More


Notre Dame researchers introduce “Quilt Packaging” to address interchip interconnect problem

Notre Dame, Oct. 2006: A team of University of Notre Dame researchers led by Gary H. Bernstein, professor of electrical engineering, has demonstrated a new technology for inter-computer chip communication called Quilt Packaging that may further the evolution of high-performance electronic systems. More


New research paper suggests the possibility of magnetic logic

Notre Dame, Jan. 2006: A paper published by a team of University of Notre Dame researchers in the January 13 edition of the journal Science reveals the demonstration of logic in a magnetic system, thereby opening the door to all-magnetic information processing systems. More


Bernstein named IEEE Fellow

Notre Dame, Nov. 2005: The world’s largest technical professional society, the IEEE is composed of more than 365,000 members who focus on advancing the theory and practice of electrical, electronics and computer engineering. More